그림 16. 피인용 수에 따른 특허 수의 분포
| ○ | 디스플레이 기술에 속하는 특허 66730편 중 (2021-2024년 출판된 특허), 적어도 1회 이상 인용된 특허 수는 16475편(24.69%)임. |
| ○ | 디스플레이 기술에 속하는 특허 중 피인용수가 높은 특허 리스트를 표 18 에 나타내었음. |
표 18. 고 피인용 특허 목록
| 번호 | 특허제목(미국특허번호) | 출원인 | 패밀리 특허번호 | 피인용 수 |
|---|---|---|---|---|
| 1 | Tissue loading of a surgical instrument (10952759) |
Ethicon LLC(US, PR, Guaynabo) | JP 2022024103 A 20220208; JP 2019524370 A 20190905; BR 112019003694 A2 20190604; CN 109640846 B 20220415; CN 109640846 A 20190416; US 2018078268 A1 20180322; US 10952759 B2 20210323; EP 3503822 A1 20190703; WO 2018039412 A1 20180301 | 295 |
| 2 | Pressure detectable touch input device including display module (10983646) |
HiDeep Inc.(KR, Seongnam-si) | EP 3312705 A1 20180425; EP 3312705 A4 20190102; WO 2016204423 A1 20161222; KR 101719208 B1 20170323; KR 20160149030 A 20161227; CN 107667335 B 20210309; CN 107667335 A 20180206; JP 2018510431 A 20180412; JP 6496421 B2 20190403; US 2018150153 A1 20180531; US 10983646 B2 20210420 | 268 |
| 3 | Method of selective silicon germanium epitaxy at low temperatures (11018003) |
APPLIED MATERIALS INC(US, CA, Santa Clara) | KR 102501287 B1 20230221; KR 20210027511 A 20210310; CN 110783171 A 20200211; EP 3830860 A4 20220420; EP 3830860 A1 20210609; WO 2020028028 A1 20200206; US 11018003 B2 20210525; US 2020035489 A1 20200130; TW 202013453 A 20200401 | 179 |
| 4 | Ceramic heater and esc with enhanced wafer edge performance (10950477) |
APPLIED MATERIALS INC(US, CA, Santa Clara) | CN 114121760 A 20220301; CN 107301970 A 20171027; KR 20170118011 A 20171024; CN 206163469 U 20170510; TW 201721801 A 20170616; TW I673823 B 20191001; CN 106449503 A 20170222; CN 106449503 B 20221206; KR 20170017826 A 20170215; US 2017040198 A1 20170209; US 10950477 B2 20210316 | 152 |
| 5 | Interlayer connection of stacked microelectronic components (11171117) |
Invensas Bonding Technologies, Inc.(US, CA, San Jose) | US 2022028835 A1 20220127; CN 112514059 A 20210316; US 11171117 B2 20211109; US 2019378820 A1 20191212; WO 2019241367 A1 20191219 | 47 |
| 6 | Molded direct bonded and interconnected stack (11158606) |
Invensas Bonding Technologies, Inc.(US, CA, San Jose) | US 2022020729 A1 20220120; US 11158606 B2 20211026; US 2020013754 A1 20200109; WO 2020010136 A1 20200109; TW 202006890 A 20200201 | 47 |
| 7 | Diffusion barrier collar for interconnects (11031285) |
Invensas Bonding Technologies, Inc.(US, CA, San Jose) | US 11694925 B2 20230704; US 2021257253 A1 20210819; KR 20220036996 A 20220323; EP 4044229 A2 20220817; EP 4044229 A3 20221130; CN 114914227 A 20220816; EP 3692568 A1 20200812; EP 3692568 A4 20210609; WO 2019070571 A1 20190411; US 11031285 B2 20210608; US 2019109042 A1 20190411; TW I756476 B 20220301; TW 201926621 A 20190701; CN 111095532 A 20200501; KR 20200052893 A 20200515 | 47 |
| 8 | DBI to Si bonding for simplified handle wafer (10964664) |
Invensas Bonding Technologies, Inc.(US, CA, San Jose) | US 2021233889 A1 20210729; CN 112020763 A 20201201; TW 202004976 A 20200116; WO 2019204532 A1 20191024; US 10964664 B2 20210330; US 2019326252 A1 20191024 | 46 |
| 9 | Multi-metal contact structure in microelectronic component (11088099) |
Invensas Bonding Technologies, Inc.(US, CA, San Jose) | US 2021335737 A1 20211028; US 11088099 B2 20210810; US 2020105692 A1 20200402; TW I733997 B 20210721; TW 201843772 A 20181216; WO 2018170093 A1 20180920; WO 2018170093 A8 20191128; US 10515913 B2 20191224; US 2018269172 A1 20180920 | 46 |
| 10 | Bonding surfaces for microelectronics (11056348) |
INVENSAS BONDING TECHNOLOGIES, INC.(US, CA, San Jose) | US 2021287910 A1 20210916; US 11056348 B2 20210706; US 2019311911 A1 20191010 | 46 |
| 11 | Offset pads over TSV (10998292) |
Invensas Bonding Technologies, Inc.(US, CA, San Jose) | CN 114899166 A 20220812; US 2021257341 A1 20210819; KR 20210009426 A 20210126; KR 102552215 B1 20230705; KR 20210008918 A 20210125; CN 112470270 A 20210309; CN 112470270 B 20220603; CN 112585740 A 20210330; TW 202002111 A 20200101; WO 2019241417 A1 20191219; WO 2019241561 A1 20191219; EP 3807927 A4 20220223; EP 3807927 A1 20210421; US 2019385935 A1 20191219; US 10998292 B2 20210504; US 2019385982 A1 20191219 | 46 |
| 12 | Stacked devices and methods of fabrication (11276676) |
INVENSAS BONDING TECHNOLOGIES, INC.(US, CA, San Jose) | US 2022189941 A1 20220616; US 11276676 B2 20220315; US 2019355706 A1 20191121 | 44 |
| 13 | Artificial neuron based on ferroelectric circuit element (10963776) |
NaMLab gGmbH(DE, Dresden) | US 10963776 B2 20210330; US 2020065647 A1 20200227 | 43 |
| 14 | Direct-bonded optoelectronic interconnect for high-density integrated photonics (11011503) |
INVENSAS BONDING TECHNOLOGIES, INC.(US, CA, San Jose) | US 11011503 B2 20210518; US 2019189603 A1 20190620; WO 2019118846 A1 20190620; CN 111480236 A 20200731; US 2021265331 A1 20210826 | 38 |
| 15 | Transistor level interconnection methodologies utilizing 3D interconnects (10991804) |
Xcelsis Corporation(US, CA, San Jose) | US 2023138732 A1 20230504; US 11688776 B2 20230627; US 2021217858 A1 20210715; US 10991804 B2 20210427; US 2019305093 A1 20191003 | 37 |
| 16 | Three dimensional circuit implementing machine trained network (11176450) |
Xcelsis Corporation(US, CA, San Jose) | US 10970627 B2 20210406; US 2020293872 A1 20200917; US 2022108161 A1 20220407; US 10762420 B2 20200901; US 2019042377 A1 20190207; US 10719762 B2 20200721; US 2019043832 A1 20190207; US 10607136 B2 20200331; US 2019042912 A1 20190207; US 11176450 B2 20211116; US 2019042929 A1 20190207 | 37 |
| 17 | Dielets on flexible and stretchable packaging for microelectronics (11355443) |
INVENSAS CORP(US, CA, San Jose) | US 10403577 B1 20190903; US 11355443 B2 20220607; US 2019341350 A1 20191107; US 2022278048 A1 20220901 | 37 |
| 18 | Direct-bonded LED structure contacts and substrate contacts (11329034) |
INVENSAS CORP(US, CA, San Jose) | US 2021288037 A1 20210916; US 11329034 B2 20220510; US 2020235085 A1 20200723; US 10629577 B2 20200421; US 2019088633 A1 20190321; TW 201843830 A 20181216; TW I742256 B 20211011; WO 2018169968 A1 20180920 | 37 |
| 19 | Die processing (10985133) |
INVENSAS BONDING TECHNOLOGIES, INC.(US, CA, San Jose) | TW I790817 B 20230121; TW 202209590 A 20220301; US 2021233888 A1 20210729; US 10985133 B2 20210420; US 2020321307 A1 20201008; JP 7106575 B2 20220726; JP 2020518133 A 20200618; US 10714449 B2 20200714; US 2019371761 A1 20191205; CN 110546754 A 20191206; KR 102391159 B1 20220426; KR 20190133256 A 20191202; US 10515925 B2 20191224; US 2019189588 A1 20190620; TW I748080 B 20211201; TW 201842634 A 20181201; EP 3613073 A4 20210602; EP 3613073 A1 20200226; US 2018308819 A1 20181025; US 10269756 B2 20190423; WO 2018194827 A1 20181025 | 37 |
| 20 | Mixed exposure for large die (11264357) |
INVENSAS CORP(US, CA, San Jose) | US 11264357 B1 20220301; US 2022216180 A1 20220707 | 37 |
| 21 | Systems and methods for releveled bump planes for chiplets (11348898) |
Xcelsis Corporation(US, CA, San Jose) | US 11348898 B2 20220531; US 2021175206 A1 20210610; US 2021249383 A1 20210812; US 10910344 B2 20210202; US 2019393190 A1 20191226 | 37 |
| 22 | Stacked IC structure with system level wiring on multiple sides of the IC die (10950547) |
Xcelsis Corporation(US, CA, San Jose) | US 10950547 B2 20210316; US 2020273798 A1 20200827; US 2021202387 A1 20210701; US 2018331037 A1 20181115; US 10580735 B2 20200303 | 37 |
| 23 | Back biasing of FD-SOI circuit blocks (11127738) |
Xcelsis Corporation(US, CA, San Jose) | US 2022020741 A1 20220120; US 11127738 B2 20210921; US 2019252375 A1 20190815 | 37 |
| 24 | Image sensor device (11069734) |
INVENSAS CORPORATION(US, CA, San Jose) | US 11069734 B2 20210720; US 2019348459 A1 20191114; US 2021366970 A1 20211125 | 31 |
| 25 | Low power ferroelectric based majority logic gate adder (10944404) |
Kepler Computing, Inc.(US, CA, San Francisco) | US 10944404 B1 20210309; WO 2021133988 A1 20210701; US 11502691 B2 20221115; US 2021203326 A1 20210701; TW I755218 B 20220211; TW 202135471 A 20210916 | 30 |
| 26 | Pulsing scheme for a ferroelectric memory bit-cell to minimize read or write disturb effect and refresh logic (11482270) |
Kepler Computing Inc.(US, CA, San Francisco) | US 11482270 B1 20221025; US 11521668 B1 20221206; US 11538514 B1 20221227; US 11532344 B1 20221220; US 11610619 B1 20230321; US 11610620 B1 20230321; US 11605413 B1 20230314; US 11646071 B1 20230509; US 11664060 B1 20230530; US 11694737 B1 20230704 | 29 |
| 27 | Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics (11011494) |
INVENSAS BONDING TECHNOLOGIES, INC.(US, CA, San Jose) | TW 202025393 A 20200701; CN 112956011 A 20210611; CN 112956011 B 20220726; US 2022005784 A1 20220106; CN 115332207 A 20221111; US 2023118156 A1 20230420; WO 2020046677 A1 20200305; EP 3821461 A4 20220209; EP 3821461 A1 20210519; US 11011494 B2 20210518; US 2020075534 A1 20200305 | 29 |
| 28 | XBAR resonators with non-rectangular diaphragms (10998882) |
Resonant Inc.(US, TX, Austin) | US 2021105002 A1 20210408; US 2021105003 A1 20210408; US 10998882 B2 20210504; US 2020235719 A1 20200723 | 29 |
| 29 | Bonded structures (11004757) |
Invensas Bonding Technologies, Inc.(US, CA, San Jose) | US 11004757 B2 20210511; US 2019348336 A1 20191114; WO 2019221974 A1 20191121; TW I781320 B 20221021; TW 202011534 A 20200316; US 2021265227 A1 20210826; TW 202316586 A 20230416 | 28 |
| 30 | Directional illumination apparatus and privacy display (11016341) |
RealD Spark, LLC(US, CA, Beverly Hills) | CN 114730044 A 20220708; US 11016341 B2 20210525; US 2021072595 A1 20210311; EP 4028804 A1 20220720; WO 2021050967 A1 20210318 | 27 |
| 31 | Surgical generator for ultrasonic and electrosurgical devices (11090104) |
CILAG GMBH INT(CH, Zug) | US 2021393314 A1 20211223; US 11090104 B2 20210817; US 2019282292 A1 20190919 | 27 |